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Advances in Chemical Mechanical Planarization (CMP)

Author : Suryadevara Babu
Publisher : Woodhead Publishing
Release : 2021-09-24
Category : Technology & Engineering
ISBN : 9780128218198

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Book Advances in Chemical Mechanical Planarization (CMP) Description/Summary:

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Advances in Chemical-Mechanical Polishing: Volume 816

Author : Materials Research Society. Meeting
Publisher : Unknown
Release : 2004-09
Category : Science
ISBN : UOM:39015059125883

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Book Advances in Chemical-Mechanical Polishing: Volume 816 Description/Summary:

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other metal films. Nonconventional materials include those of increasing importance in advanced semiconductor, MEMS, and nanotechnologies, such as low-k dielectrics and polymer, nickel, and ruthenium films. CMP in IC fabrication continues to pose substantial problems - for virgin silicon wafer preparation, shallow-trench isolation (STI) structures, and poly or other deep-trench structure formation, as well as copper and low-k metal interconnect. New developments in CMP pads and slurries are presented. Novel polishing methods and are described. Advances in CMP process understanding and modeling are also highlighted.

Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices

Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
Publisher : William Andrew
Release : 2011-12
Category : Science
ISBN : 9781437778595

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Book Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices Description/Summary:

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Abrasive Technology

Author : Anna Rudawska
Publisher : BoD – Books on Demand
Release : 2018-10-24
Category : Technology & Engineering
ISBN : 9781789841930

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Book Abrasive Technology Description/Summary:

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.

Emerging Contaminants

Author : Aurel Nuro
Publisher : BoD – Books on Demand
Release : 2021-05-27
Category : Science
ISBN : 9781839624186

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Book Emerging Contaminants Description/Summary:

Emerging Contaminants presents the reader with information on classification, recent studies, and adverse effects on the environment and human health of the main classes of contaminants. Emerging contaminants are synthetic or natural compounds and microorganisms produced and used by humans that cause adverse ecological and human health effects when they reach the environment. This book is organized into four sections that cover the classification of contaminants and the instrumental techniques used to quantify them, recent studies on pesticides, antibiotics as an important group of emerging contaminants, and studies of different classes of emerging contaminants such as polybrominated diphenyl ethers (PBDEs), microplastics, and others.

Chemical-Mechanical Planarization:

Author : Duane S. Boning,Katia Devriendt,Michael R. Oliver,David J. Stein,Ingrid Vos
Publisher : Cambridge University Press
Release : 2014-06-05
Category : Technology & Engineering
ISBN : 1107409411

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Book Chemical-Mechanical Planarization: Description/Summary:

Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.

Microelectronic Applications of Chemical Mechanical Planarization

Author : Yuzhuo Li
Publisher : John Wiley & Sons
Release : 2008
Category : Science
ISBN : 0471719196

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Book Microelectronic Applications of Chemical Mechanical Planarization Description/Summary:

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: Provides in-depth coverage of a wide range of state-of-the-art technologies and applications Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers

Author : Imin Cao,Milind Bhagavat
Publisher : John Wiley & Sons
Release : 2021-03-22
Category : Technology & Engineering
ISBN : 9780470061213

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Book Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers Description/Summary:

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

Advances and Challenges in Chemical Mechanical Planarization:

Author : Gerfried Zwicker,Christopher Borst,Laertis Economikos,Ara Philipossian
Publisher : Cambridge University Press
Release : 2014-06-05
Category : Technology & Engineering
ISBN : 1107408709

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Book Advances and Challenges in Chemical Mechanical Planarization: Description/Summary:

Chemical mechanical planarization (CMP) has been a leading-edge technology in semiconductor processing for the past 15−20 years. A successful CMP process is based in fundamental science across the disciplines of mechanical engineering, chemical engineering, colloid science, materials science and chemistry. Traditionally, the MRS Spring Meeting serves as a nexus for multidisciplinary interaction and discussion between CMP researchers in both industry and academia. The papers in this book are from the 2007 MRS Spring Meeting and address the fluid and wear mechanics that occur when using CMP tools and pad/slurry consumables, as well as the surface mechanisms required for effective post-CMP cleaning. It also focuses on new successes and challenges in technologies such as electrochemical mechanical planarization (eCMP), three-dimensional integration and advanced CMP process modeling and control strategies.

Advanced Microsystems for Automotive Applications 2003

Author : Jürgen Valldorf,Wolfgang Gessner
Publisher : Springer Science & Business Media
Release : 2007-12-22
Category : Technology & Engineering
ISBN : 9783540769880

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Book Advanced Microsystems for Automotive Applications 2003 Description/Summary:

Microsystems are an important factor that contribute to an automobile model's success. To meet the customer's desire for safety, convenience and vehicle economy, and to satisfy environmental standards, microsystems play a critical factor. Microsystems applications (MST) have already resulted in improved performance and better value for money. But the advances implemented reveal only the beginning of a revolution in the vehicle sector, which aims at a complete transition from the mechanically driven automobile system to a mechanically based but ICT-driven system. The selected contributions from AMAA 2003 treat safety (both preventive and protective), powertrain (online measurement and control of engine and transmission subsystems), comfort and HMI (systems to enhance the comfort of passengers and human machine interface issues), and networked Vehicle (all aspects of intra car systems and ambient communication networks).

Advances in CMP Polishing Technologies

Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
Publisher : William Andrew
Release : 2011-11-30
Category : Science
ISBN : 9781437778601

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Book Advances in CMP Polishing Technologies Description/Summary:

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Advances in Chemical-Mechanical Polishing:

Author : Duane S. Boning,Johann W. Bartha,Ara Philipossian,Greg Shinn,Ingrid Vos
Publisher : Cambridge University Press
Release : 2014-06-05
Category : Technology & Engineering
ISBN : 1107409195

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Book Advances in Chemical-Mechanical Polishing: Description/Summary:

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other metal films. Nonconventional materials include those of increasing importance in advanced semiconductor, MEMS, and nanotechnologies, such as low-k dielectrics and polymer, nickel, and ruthenium films. CMP in IC fabrication continues to pose substantial problems - for virgin silicon wafer preparation, shallow-trench isolation (STI) structures, and poly or other deep-trench structure formation, as well as copper and low-k metal interconnect. New developments in CMP pads and slurries are presented. Novel polishing methods and are described. Advances in CMP process understanding and modeling are also highlighted.

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

Author : Christopher Lyle Borst,William N. Gill,Ronald J. Gutmann
Publisher : Springer Science & Business Media
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 9781461511656

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Book Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses Description/Summary:

As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.

Chemical-Mechanical Planarization of Semiconductor Materials

Author : M.R. Oliver
Publisher : Springer Science & Business Media
Release : 2013-03-14
Category : Technology & Engineering
ISBN : 9783662062340

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Book Chemical-Mechanical Planarization of Semiconductor Materials Description/Summary:

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Author : Jie Cheng
Publisher : Springer
Release : 2017-09-06
Category : Technology & Engineering
ISBN : 9789811061653

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Book Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect Description/Summary:

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.

Advances in Abrasive Based Machining and Finishing Processes

Author : S. Das,G. Kibria,B. Doloi,B. Bhattacharyya
Publisher : Springer Nature
Release : 2020-05-10
Category : Technology & Engineering
ISBN : 9783030433123

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Book Advances in Abrasive Based Machining and Finishing Processes Description/Summary:

This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with abrasive particles.

Micro/Nano Manufacturing

Author : Hans Nørgaard Hansen,Guido Tosello
Publisher : MDPI
Release : 2018-07-03
Category : Uncategorized
ISBN : 9783038426042

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Book Micro/Nano Manufacturing Description/Summary:

This book is a printed edition of the Special Issue "Micro/Nano Manufacturing" that was published in Micromachines